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Intel Federal Packaging Module Equipment Development Engineer salaries

Pay ranges Intel Federal published in 1 open job posting for Packaging Module Equipment Development Engineer roles, updated Nov 14, 2026.

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Fewer than 3 postings here list pay, so no pay figures are shown.

Posted base pay ranges from job listings, not total compensation. How these figures are made

Locations

  1. United States · 1 posting
  2. Arizona · 1 posting
  3. Phoenix, AZ · 1 posting

Newest Intel Federal Packaging Module Equipment Development Engineer postings

  1. Packaging Module Equipment Development EngineerIntel Federal · Phoenix, AZ · $99K–$189K/yr · Posted Nov 3, 2026
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