Applystead salaries · 4 posted pay ranges
Packaging Module Equipment Development Engineer salaries
Pay ranges employers published in 4 open job postings for Packaging Module Equipment Development Engineer roles at 2 companies, updated Nov 14, 2026.
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- Median base pay$144,000a year
- Typical range$144,000–$144,000Middle half of postings
- Top 10%$144,000and above
- Postings4with a pay range
Posted base pay ranges from job listings, not total compensation. Figures are in USD. How these figures are made
Pay distribution
Postings per pay band: $140K–$145K: 4.
Pay by level
Companies hiring
Top-paying companies
- Intel · $144K median, 3 postings
By location
Remote vs on-site
Remote: too few postings list pay to show a figure. On-site: $144K median, $144K–$144K typical, from 3 postings.
Newest Packaging Module Equipment Development Engineer postings
- Packaging Module Equipment Development EngineerIntel Federal · Phoenix, AZ · $99K–$189K/yr · Posted Nov 3, 2026
- Packaging Module Equipment Development EngineerIntel · Phoenix, AZ · $99K–$189K/yr · Posted Oct 27, 2026
- Packaging Module Equipment Development EngineerIntel · Chandler, AZ · $99K–$189K/yr · Posted Aug 26, 2026
- Packaging Module Equipment Development EngineerIntel · United States · $99K–$189K/yr · Posted Aug 25, 2026
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Related roles
Software EngineerSystems EngineerElectrical EngineerMechanical EngineerBusiness Development Manager
Questions and answers
How much does a Packaging Module Equipment Development Engineer make?
The median posted base pay for Packaging Module Equipment Development Engineer jobs is $144K a year, from 4 job postings with pay at 2 companies.
What is the typical Packaging Module Equipment Development Engineer pay range?
The middle half of postings list $144K–$144K. The top 10% list $144K a year or more, and the lowest 10% $144K or less.
Which companies pay the most for Packaging Module Equipment Development Engineer jobs?
By median posted pay: Intel ($144K).