SALARIES · 9 POSTED PAY RANGES
Packaging Module Development Engineer salaries in United States
Pay ranges employers published in 9 open job postings for Packaging Module Development Engineer roles in United States, updated Sep 30, 2026.
- Median base pay$167,300a year
- Typical range$161,300–$176,700Middle half of postings
- Top 10%$205,400and above
- Postings9with a pay range
Posted base pay ranges from job listings, not total compensation. Figures are in USD. How these figures are made
Newest Packaging Module Development Engineer postings in United States
- Packaging Module Development EngineerIntel · Chandler, AZ · $115K–$189K/yr · Posted Sep 30, 2026ApplyView posting
- Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$255K/yr · Posted Sep 30, 2026ApplyView posting
- Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$189K/yr · Posted Sep 28, 2026ApplyView posting
- Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$189K/yr · Posted Sep 28, 2026ApplyView posting
- Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$189K/yr · Posted Sep 28, 2026ApplyView posting
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Packaging Module Development Engineer pay in other places
All Packaging Module Development Engineer salaries
Questions and answers
How much does a Packaging Module Development Engineer make in United States?
The median posted base pay for Packaging Module Development Engineer jobs in United States is $167K a year, from 9 job postings with pay at 1 company.
What is the typical Packaging Module Development Engineer pay range in United States?
The middle half of postings list $161K–$177K. The top 10% list $205K a year or more, and the lowest 10% $152K or less.
How does United States pay compare with all Packaging Module Development Engineer jobs?
The median here is $167K, against $167K across all 9 postings for the role.
How many Packaging Module Development Engineer jobs in United States list pay?
9 open postings at 1 company list a pay range; figures use postings with at least 3 per group.
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