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SALARIES · 9 POSTED PAY RANGES

Intel Packaging Module Development Engineer salaries

Pay ranges Intel published in 9 open job postings for Packaging Module Development Engineer roles, updated Sep 30, 2026.

Posted base pay ranges from job listings, not total compensation. Figures are in USD. How these figures are made

Intel’s Packaging Module Development Engineer titles

  1. Packaging Module Development Engineer (Mid level)$167K median · $161K–$177K typical · 9 postingsPackaging Module Development Engineer (Mid level): middle half $161K–$177K, median $167K

Pay by level

  1. Mid level$167K median · $161K–$177K typical · 9 postingsMid level: middle half $161K–$177K, median $167K

Locations

  1. United States · $167K median · 9 postings
  2. Arizona · $161K median · 8 postings
  3. Chandler, AZ · $161K median · 8 postings

Newest Intel Packaging Module Development Engineer postings

  1. Packaging Module Development EngineerIntel · Chandler, AZ · $115K–$189K/yr · Posted Sep 30, 2026ApplyView posting
  2. Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$255K/yr · Posted Sep 30, 2026ApplyView posting
  3. Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$189K/yr · Posted Sep 28, 2026ApplyView posting
  4. Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$189K/yr · Posted Sep 28, 2026ApplyView posting
  5. Packaging Module Development EngineerIntel · Chandler, AZ · $134K–$189K/yr · Posted Sep 28, 2026ApplyView posting
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